Chemical dispensing system

ABSTRACT

A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.

BACKGROUND

Semiconductor processing chemicals may be supplied via a chemicaldispending system for various types of semiconductor processes, such aswet etching, lithography, chemical vapor deposition, physical vapordeposition, and/or the like. A chemical dispending system may includevarious types of storage containers for storing semiconductor processingchemicals. For example, a chemical dispending system may include astorage drum for storing bulk semiconductor processing chemical, a daytank for storing semiconductor processing chemical for daily use, and/orthe like. The semiconductor processing chemical may be pumped from theday tank to a production point of use, where the semiconductorprocessing chemical is used as part of a semiconductor process.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A and 1B are diagrams of an example chemical dispensing systemdescribed herein.

FIGS. 2A-2R are diagrams of example implementations described herein.

FIGS. 3A and 3B are diagrams of one or more example implementationsdescribed herein.

FIG. 4 is a diagram of example components of one or more devices ofFIGS. 1A, 1B, 2A-2R, 3A, and 3B.

FIG. 5 is a flowchart of an example process for dispensing asemiconductor processing chemical.

FIG. 6 is a flowchart of an example process for filtering asemiconductor processing chemical.

FIG. 7 is a flowchart of an example process for dispensing asemiconductor processing chemical.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Wafer defects can occur as a result of using a semiconductor processingchemical having impurities and other defects in a semiconductor process.While a chemical dispensing system may include one or more filters tofilter out contaminants and other impurities, not every batch ofsemiconductor processing chemical may be inspected because the chemicaldispensing system might not be capable of supporting testing andproduction in parallel. To test a batch of semiconductor processingchemical, supply to a production process is stopped, and the chemicaldispensing system is transitioned to supply a semiconductor processingtest. The process of switching the chemical dispensing system fromproduction to test and back, and the process of testing itself, aretime-consuming processes that would greatly decrease the productivity ofthe semiconductor processes supplied by the chemical dispensing systemif each new batch of semiconductor processing chemical were tested.

Some implementations described herein provide a chemical dispensingsystem that is capable of simultaneously supplying a semiconductorprocessing chemical for production and testing. The chemical dispensingsystem includes a first pump that pumps a semiconductor processingchemical from a day tank and through a first chemical supply line, and asecond pump that pumps a semiconductor processing chemical from astorage drum and through a second chemical supply line. The firstchemical supply line and the second chemical supply line are independentchemical supply lines that are capable of being configured tosimultaneously supply the semiconductor processing chemical to aproduction point of use (POU) for a semiconductor process and a test POUfor testing.

In this way, the independent chemical supply lines permit production andtesting to be performed in parallel, which reduces production downtimeof the semiconductor process, increases throughput and capability of thesemiconductor process, and/or the like. Moreover, the capability tosimultaneously supply the semiconductor processing chemical forproduction and testing allows for an increased quantity of semiconductorprocessing chemical batches to be tested with minimal impact toproduction, which increases quality control over the semiconductorprocessing chemical.

In addition, the independent chemical supply lines may be used to supplythe semiconductor processing chemical to production while independentlyfiltering semiconductor processing chemical directly from a storage druminstead of from a day tank. Since the supply of the semiconductorprocessing chemical in the day tank is consumed for daily production, itis difficult to maintain an even supply quality of the semiconductorprocessing chemical due to uneven filtering. Semiconductor processingchemical that is consumed early on may be filtered fewer times relativeto semiconductor processing chemical that is consumed later on, whichmay lead to inconsistent levels of quality of the semiconductorprocessing chemical. With the independent chemical supply lines, thechemical dispensing system is capable of supplying semiconductorprocessing chemical from the storage drum to a filtration loop prior tobeing provided to the day tank. In this way, the semiconductorprocessing chemical in the day tank is filtered evenly, which increasesthe quality of the semiconductor processing chemical.

FIGS. 1A and 1B are diagrams of an example chemical dispensing system100 described herein. In some implementations, chemical dispensingsystem 100 may also be referred to as a chemical dispense unit (CDU), achemical dispense system (CDS), a chemical supply system, or anothersystem that is capable of supplying a semiconductor processing chemicalfor one or more types of semiconductor processes, such as wet etching,lithography, chemical vapor deposition, physical vapor deposition,and/or the like. The semiconductor processing chemical may include aliquid, a gas, a slurry, and/or another form of chemical. Examples ofsemiconductor processing chemicals that may be supplied by chemicaldispensing system 100 include (but are not limited to) argon, oxygen,hydrofluoric acid, phosphoric acid, ammonium fluoride, various halides,various hydrides, various nitrides, precursor materials, bufferingagents, combinations thereof, and/or many other chemicals used invarious semiconductor processes.

As shown in FIG. 1A, chemical dispensing system 100 may include variouscomponents, such as one or more storage drums 102, one or more day tanks104, a plurality of valves 106, a plurality of pumps 108, one or moreproduction point of use (POU) manifolds 110, one or more chemical testPOU manifolds 112, a plurality of filters 114, one or more pressuretanks 116, one or more controllers 118, and/or the like. Moreover,chemical dispensing system 100 may include various types andconfigurations of plumbing fixtures for transporting, supplying, and/orotherwise providing a semiconductor processing chemical to the variouscomponents of chemical dispensing system 100, such as pipes (e.g.,copper pipes, galvanized steel pipes, cast iron pipes, polyvinylchloride (PVC) pipes, and/or the like), fittings (e.g., couplings,elbows, reducers, expanders, unions, cross fittings, tee fittings, Yfittings, and/or the like), and/or the like.

Storage drums 102 (e.g., storage drum 102 a, storage drum 102 b, and/orthe like) include one or more storage drums, one or more storagecontainers, one or more storage vessels, or one or more other types ofapparatuses capable of storing semiconductor processing chemical (e.g.,bulk or raw semiconductor processing chemical). In some implementations,storage drums 102 may be capable of storing semiconductor processingchemical for various duration lengths, such as a plurality of days, aplurality of weeks, a plurality of months, and/or the like. Storagedrums 102 may be capable of holding various amounts of semiconductorprocessing chemical, such as 100 liters, 200 liters, and/or the like.

In some implementations, a storage drums 102 may be capable of operatingin various modes, such as a supply mode in which the storage drum 102 issupplying semiconductor processing chemical to various components ofchemical dispensing system 100, a standby mode in which the storage drum102 is not supplying semiconductor processing chemical, and/or the like.In some implementations, a storage drum 102 (e.g., storage drum 102 a)may be configured to operate in a supply mode while another storage drum102 (e.g., storage drum 102 b) is configured to operate in a standbymode. In this way, a storage drum 102 in supply mode may supplysemiconductor processing chemical to various components of chemicaldispensing system 100 while another storage drum 102 in standby mode maybe refilled with semiconductor processing chemical, may be filtered(e.g., the semiconductor processing chemical in the storage drum 102 maybe circulated through a filtration loop), and/or the like.

Day tank 104 includes a tank, a drum, a storage container, a storagevessel, or another type of apparatus capable of storing a semiconductorprocessing chemical for daily use at the one or more production POUmanifolds 110, the chemical test POU manifold 112, and/or at one or moreother components. In some implementations, day tank 104 may be sized tohold an amount of semiconductor processing chemical that is expected tobe consumed for daily use, such as 500 liters or more. In someimplementations, day tank 104 has a capacity equal to or greater than acapacity of a storage drum 102.

In some implementations, semiconductor processing chemical is providedto day tank 104 from one or more storage drums 102. In someimplementations, the semiconductor processing chemical is filteredthrough one or more filters 114 prior being added to day tank 104. Insome implementations, the semiconductor processing chemical in day tank104 may be diluted (e.g., relative to the bulk or raw semiconductorprocessing chemical stored in storage drums 102), may be mixed withadditives, and/or the like prior to use at the one or more productionPOU manifolds 110, the chemical test POU manifold 112, and/or the like.

Valves 106 include various types of plumbing valves made from varioustypes of materials such as copper plumbing valves, PVC valves, cast ironvalves, and/or the like. A valve 106 may be capable of permitting thepassage of semiconductor processing chemical (e.g., when the valve 106is configured in an open position) and restricting or blocking thepassage of semiconductor processing chemical (e.g., when the valve 106is configured in a closed position). In this way, valves 106 may be usedto direct the flow of semiconductor processing chemical along variousflow paths in chemical dispensing system 100, may be used to block orrestrict the flow of semiconductor processing chemical so thatcomponents such as pumps 108 or filters 114 may be bypassed, removed formaintenance, or replaced, and/or the like. Examples of valves 106include ball valves, butterfly valves, check valves, pneumatic valves,diaphragm valves, and/or the like.

Pumps 108 include various types of pumps capable of pumping, supplying,and/or otherwise causing semiconductor processing chemical to flowthrough chemical dispensing system 100. For example, pumps 108 mayinclude centrifugal pumps, in-line pumps, reciprocating pumps, rotarypumps, and/or other types of pumps. Chemical dispensing system 100 mayinclude a plurality of pumps 108 to supply or provide semiconductorprocessing chemical through a plurality of independent chemical supplylines. In this way, chemical dispensing system 100 is capable ofsimultaneously supplying or providing semiconductor processing chemicalfrom a plurality of different sources (e.g., day tank 104 and a storagedrum 102) to a plurality of different destinations (e.g., a productionPOU manifold 110 and a chemical test POU manifold 112).

In some implementations, pump 108 a and pump 108 b may be configured topump, supply, and/or otherwise cause semiconductor processing chemicalin day tank 104 to flow through a chemical supply line of chemicaldispensing system 100. In some implementations, pump 108 a may be aprimary pump for day tank 104, and pump 108 b may be a secondary orbackup pump for day tank 104 that is used if pump 108 a fails,experiences abnormal behavior, or is in the process of being replaced orserviced. Moreover, pump 108 c may be configured to pump, supply, and/orotherwise cause semiconductor processing chemical in storage drums 102to flow through a chemical supply line and/or a filtration loop ofchemical dispensing system 100 to various locations, such as day tank104, production POU manifold 110, chemical test POU manifold 112, and/orthe like. Pump 108 c is different from and may operate (or be operated)independent of pump 108 a and pump 108 b.

Production POU manifold(s) 110 includes various types of manifolds ormanifold systems capable of supplying or providing a semiconductorprocessing chemical to a plurality of semiconductor processing POUs forproduction use. Examples of semiconductor processing POUs include (butare not limited to) a chemical vapor deposition processing chamber, aphysical vapor deposition processing chamber, a spin coating machine, awet etch bath, and/or another location in a semiconductor processingfacility where the semiconductor processing chemical is used in asemiconductor process. Chemical test POU manifold 112 includes varioustypes of manifolds or manifold systems capable of supplying or providinga semiconductor processing chemical to a plurality of testing POUs.Examples of testing POUs include (but are not limited to) a testfixture, a test chamber, a lab, and/or the like.

Filters 114 include various types of filters capable of filteringcontaminants, foreign material, and/or other types of impurities from asemiconductor processing chemical stored and/or supplied by chemicaldispensing system 100. For example, filters 114 may include membranefilters, pleated filters, cylindrical filters, mesh filters, and/orother types of filters capable of filtering liquids and/or gasses. Insome implementations, subsets of the filters 114 included in chemicaldispensing system 100 may be configured to perform various types offiltrations. For example, one or more filters 114 may be configured toperform loop filtration, recirculation filtration, or another type offiltration in which semiconductor processing chemical is circulatedthrough a filtration loop. As another example, one or more filters 114may be configured to perform final stage filtration, a one-passfiltration, POU filtration, or another type of filtration in whichsemiconductor processing chemical is filtered prior to being supplied toa production POU manifold 110 for use in a semiconductor process or achemical test POU manifold 112 for testing. In some implementations, aportion of the semiconductor processing chemical processed through afinal stage filtration may be returned to day tank 104 to ensure an evenflow of semiconductor processing chemical to production POU manifold(s)110 and/or chemical test POU manifold 112.

Pressure tank(s) 116 include one or more tanks, vessels, containers, orother types of apparatuses capable of holding semiconductor processingchemical while the semiconductor processing chemical is pressurizedusing a pressurized gas (e.g., nitrogen, oxygen, and/or the like). Forexample pressure tank(s) 116 may each hold 20 liters of semiconductorprocessing chemical or another volume. The semiconductor processingchemical in pressure tank(s) 116 may be pressurized to maintain an evenflow and supply of semiconductor processing chemical to production POUmanifold(s) 110 and/or chemical test POU manifold 112.

As shown in FIG. 1B, chemical test POU manifold 112 may include aplurality of valves 106, a chemical test supply line 120, a productionsupply line 122, a sampling line 124, a flush drain line 126, and/or oneor more other components and combinations thereof. Chemical test supplyline 120 may supply semiconductor processing chemical (e.g., a raw orbulk supply semiconductor processing chemical) to one or more testingPOUs 128 via one or more valves 106. Similarly, production supply line122 may supply semiconductor processing chemical (e.g., a productionsemiconductor processing chemical) to one or more testing POUs 128 viaone or more valves 106. Valves 106 (e.g., POU valves) may be used torestrict flow of semiconductor processing chemical to particular testingPOUs 128, may be used to permit flow of semiconductor processingchemical to particular testing POUs 128, may be used to restrict orpermit flow to chemical test supply line 120, production supply line122, and/or sampling line 124, and/or the like.

Sampling line 124 may be used to directly test the semiconductorprocessing chemical from production POU manifold(s) 110 and/or chemicaltest POU manifold 112 for increased quality control sampling. Flushdrain line 126 may be used to drain or flush semiconductor processingchemical from chemical test POU manifold 112. Flush drain line 126 mayreduce and/or minimize the risk of dead zone residue contamination inchemical test POU manifold 112.

The number and arrangement of components shown in FIGS. 1A and 1B areprovided as an example. In practice, chemical dispensing system 100 mayinclude additional components, fewer components, different components,or differently arranged components than those shown in FIGS. 1A and/or1B. Additionally, or alternatively, a set of components (e.g., one ormore components) of chemical dispensing system 100 may perform one ormore functions described as being performed by another set of componentsof chemical dispensing system 100.

FIGS. 2A-2R are diagrams of example implementations 200 describedherein. As shown in FIGS. 2A-2R, example implementations 200 may includea chemical dispensing system, such as chemical dispensing system 100illustrated and described above in connection with FIGS. 1A and 1B.

As shown in FIG. 2A, chemical dispensing system 100 may operate in aproduction supply configuration, in which one or more components ofchemical dispensing system 100 form a chemical supply line 202 that isconfigured to provide a semiconductor processing chemical from day tank104 at least to production POU manifold(s) 110. Chemical supply line 202may be composed of various components included in chemical dispensingsystem 100, such as one or more valves 106, one or more filters 114, oneor more pressure tanks 116, one or more pipes, one or more fittings,and/or one or more other types of plumbing fixtures. In the productionsupply configuration, one or more valves 106, one or more pumps 108(e.g., pump 108 a, pump 108 b, and/or the like), one or more filters114, one or more pressure tanks 116, one or more pipes, one or morefittings, and/or one or more other plumbing fixtures included inchemical dispensing system 100 may be opened, closed, connected, and/orotherwise configured such that the semiconductor processing chemical inday tank 104 is directed along a flow path of chemical supply line 202to production POU manifold(s) 110 and, in some cases, chemical test POUmanifold 112.

As shown in FIG. 2B, and by reference number 204, controller 118 maydetermine that a test is to be performed. In some implementations,controller 118 may determine to perform a maintenance component test oranother type of test that is performed to check the performance ofchemical dispensing system 100 after a new component is added tochemical dispensing system 100, after a component in chemical dispensingsystem 100 is replaced, after a chemical dispensing system 100 isrepaired, and/or the like. In these cases, semiconductor processingchemical stored in day tank 104 and/or semiconductor processing chemicalstored in a storage drum 102 may be provided to chemical test POUmanifold 112 for sampling and testing as part of the test. In someaspects, controller 118 may determine to perform a semiconductorprocessing chemical test based on a new batch of semiconductorprocessing chemical being added to a storage drum 102. In these cases,the semiconductor processing chemical in the storage drum 102 may beprovided to chemical test POU manifold 112 for sampling and testing.

In some implementations, controller 118 may determine that a test is tobe performed based on receiving an instruction to perform the test. Insome implementations, the instruction may include an input from a uservia an input device such as a mouse, a keyboard, a touch screen, amicrophone to capture a voice command, and/or the like. In someimplementations, the instruction may include an instruction received asinput from another component included in chemical dispensing system 100(e.g., another controller 118 and/or the like). In some implementations,the instruction may include an instruction received as input from acomponent that is remote from chemical dispensing system 100, such as aremote computer, a cloud computing environment, and/or the like.

As further shown in FIG. 2B, and by reference number 206, controller 118may cause chemical dispensing system 100 to be transitioned from theproduction supply configuration to an independent production and testconfiguration. In some implementations, controller 118 causes chemicaldispensing system 100 to be transitioned from the production supplyconfiguration to an independent production and test configuration basedon determining to perform a test (e.g., a test of chemical dispensingsystem 100, a maintenance component test, a semiconductor processingchemical test, and/or the like). Controller 118 may cause chemicaldispensing system 100 to be transitioned from the production supplyconfiguration to an independent production and test configuration byautomatically closing one or more valves 106, opening one or more valves106, activating one or more pumps 108, deactivating one or more pumps108, reconfiguring and/or rearranging one or more filters 114 (e.g., oneor more filters 114 that provide a final stage filtration, a one-passfiltration stage, POU filtration, and/or the like), reconfiguring and/orrearranging one or more pipes, fittings, and/or other plumbing fixtures,and/or the like.

Semiconductor processing chemical may be supplied or provided tochemical test POU manifold 112 so that a test of the semiconductorprocessing chemical may be performed to generate wafer test data. Thewafer test data may include information identifying one or moreparameters for the semiconductor processing chemical. The one or moreparameters may be indicators of the performance of the semiconductorprocessing chemical, may be indicators of the quality level of thesemiconductor processing chemical, and/or the like. For example, the oneor more parameters may indicate a purity of the semiconductor processingchemical, may indicate a level of impurities included in thesemiconductor processing chemical, may indicate a coverage performance(e.g., a spin coating coverage performance), may indicate one or moremeasurements of a wafer (e.g., a feature size measurement, a structuremeasurement, and/or the like), may indicate an etch rate, and/or mayindicate one or more other indicators of performance and/or quality ofthe semiconductor processing chemical. In some implementations,controller 118 may determine whether the one or more parameters for thesemiconductor processing chemical satisfy one or more associatedthresholds (e.g., a purity threshold, a level of impurities threshold,one or more performance thresholds, and/or the like) and may selectivelycause another test to be performed based on a result of thedetermination. Moreover, if controller 118 determines that a parameterfor the semiconductor processing chemical does not satisfy a threshold,controller 118 may cause the semiconductor processing chemical to befiltered for one or more cycles prior to performing the other test.

FIGS. 2C-2R illustrate various example independent production andtesting configurations for chemical dispensing system 100. As shown inFIGS. 2C-2R, in an independent production and testing configuration,chemical dispensing system 100 may be configured such that chemicalsupply line 202 and another chemical supply line 208 are configured tosimultaneously and independently provide and/or supply a semiconductorprocessing chemical to production POU manifold(s) 110 and chemical testPOU manifold 112. Chemical supply line 202 and another chemical supplyline 208 may independently provide and/or supply a semiconductorprocessing chemical in that chemical supply line 202 and chemical supplyline 208 supply the semiconductor processing chemical from independentsources and using different valves 106, different pumps 108, differentfilters 114, and/or different pipes such that chemical supply line 202and chemical supply line 208 supply the semiconductor processingchemical using different flow paths through chemical dispensing system100.

In particular, chemical supply line 202 is configured to provide and/orsupply a semiconductor processing chemical from day tank 104, andchemical supply line 208 is configured to provide and/or supply asemiconductor processing chemical from a storage drum 102 (e.g., storagedrum 102 a, storage drum 102 b, and/or the like). Moreover, chemicalsupply line 202 is configured to provide and/or supply a semiconductorprocessing chemical from day tank 104 through the use of pump 108 a orpump 108 b, whereas chemical supply line 208 is configured to provideand/or supply a semiconductor processing chemical from a storage drum102 through the use of pump 108 c. In these cases, pump 108 a or pump108 b may pump and/or otherwise cause the semiconductor processingchemical in day tank 104 to traverse along the flow path of chemicalsupply line 202, and pump 108 c may pump and/or otherwise cause thesemiconductor processing chemical in the storage drum 102 to traversealong the flow path of chemical supply line 208. In this way, chemicalsupply line 202 may supply the semiconductor processing chemical in daytank 104 in a manner in which the use of the semiconductor processingchemical in day tank 104 does not impact or affect the use and supply ofthe semiconductor processing chemical in the storage drum 102.Similarly, chemical supply line 208 may supply the semiconductorprocessing chemical in the storage drum 102 in a manner in which the useof the semiconductor processing chemical in the storage drum 102 doesnot impact or affect the use and supply of the semiconductor processingchemical in day tank 104.

As further shown in FIGS. 2C-2R, in an independent production andtesting configuration, chemical supply line 202 and chemical supply line208 may be configured to supply semiconductor processing chemical todifferent POU manifolds. For example, chemical supply line 202 may beconfigured to provide semiconductor processing chemical from day tank104 to one or more production POU manifolds 110, whereas chemical supplyline 208 may be configured to provide semiconductor processing chemicalfrom a storage drum 102 to chemical test POU manifold 112. As anotherexample, chemical supply line 202 may be configured to providesemiconductor processing chemical from day tank 104 to chemical test POUmanifold 112, whereas chemical supply line 208 may be configured toprovide semiconductor processing chemical from a storage drum 102 to oneor more production POU manifolds 110.

As shown in FIG. 2C, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2C, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2D, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2D, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2E, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2E, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2F, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2F, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2G, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2G, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2H, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2H, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2I, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2I, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2J, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 to one ormore production POU manifolds 110 through one or more valves 106, pump108 b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2J, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to chemicaltest POU manifold 112 through a flow path, independent from the flowpath of chemical supply line 202, that includes one or more valves 106,pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2K, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2K, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2L, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2L, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2M, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2M, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2N, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2N, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2O, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2O, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2P, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108a, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2P, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2Q, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2Q, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 b to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As shown in FIG. 2R, an example independent production and testingconfiguration may include chemical supply line 202 being configured toprovide a semiconductor processing chemical from day tank 104 tochemical test POU manifold 112 through one or more valves 106, pump 108b, a pressure tank 116, a filter 114, one or more pipes, fittings,and/or other plumbing fixtures, and/or the like. Moreover, in theexample independent production and testing configuration illustrated inFIG. 2R, chemical supply line 208 may be configured to provide asemiconductor processing chemical from storage drum 102 a to one or moreproduction POU manifolds 110 through a flow path, independent from theflow path of chemical supply line 202, that includes one or more valves106, pump 108 c, a filter 114, one or more pipes, fittings, and/or otherplumbing fixtures, and/or the like.

As indicated above, FIGS. 2A-2R are provided as examples. Other examplesmay differ from what is described with regard to FIGS. 2A-2R.

FIGS. 3A and 3B are diagrams of one or more example implementations 300described herein. As shown in FIGS. 3A and 3B, example implementation(s)300 may include a chemical dispensing system, such as chemicaldispensing system 100 illustrated and described above in connection withFIGS. 1A and 1B.

As shown in FIG. 3A, and by reference number 302, controller 118 maydetermine to filter a semiconductor processing chemical in a storagedrum 102. In some implementations, controller 118 may determine tofilter the semiconductor processing chemical based on determining that anew batch of semiconductor processing chemical has been added to thestorage drum 102, based on determining that the storage drum 102 is in astandby mode (e.g., a mode in which the storage drum 102 is notsupplying semiconductor processing chemical to a production POU manifold110 or a chemical test POU manifold 112), and/or the like. In someimplementations, controller 118 may determine to filter thesemiconductor processing chemical based on receiving an instruction tofilter the semiconductor processing chemical in the storage drum 102. Insome implementations, the instruction may include an input from a uservia an input device such as a mouse, a keyboard, a touch screen, amicrophone to capture a voice command, and/or the like. In someimplementations, the instruction may include an instruction received asinput from another component included in chemical dispensing system 100(e.g., another controller 118 and/or the like). In some implementations,the instruction may include an instruction received as input from acomponent that is remote from chemical dispensing system 100, such as aremote computer, a cloud computing environment, and/or the like.

As further shown in FIG. 3A, and by reference number 304, controller 118may identify a configured quantity of filtration cycles for filteringthe semiconductor processing chemical in the storage drum 102. Theconfigured quantity of filtration cycles may be a set and/or configuredquantity of times that new batches of semiconductor processing chemicalare filtered through a filtration loop (e.g., 3 times through thefiltration loop, 5 times through the filtration loop, and/or the like)after being added to the storage drum 102 and prior to being used tosupply semiconductor processing chemical to day tank 104. The configuredquantity of filtration cycles is used to filter each new batch ofsemiconductor processing chemical the same quantity of filtrationcycles, thereby ensuring a similar level of filtration and a similarlevel of quality control across batches of semiconductor processingchemical.

Controller 118 may identify the configured quantity of filtration cyclesbased on information identifying the configured quantity of filtrationcycles. In some implementations, the information identifying theconfigured quantity of filtration cycles is included in a data structureof controller 118, such as a memory component, a storage component, anelectronic database, an electronic table, an electronic file or filesystem, and/or the like. In some implementations, the informationidentifying the configured quantity of filtration cycles is included ina data structure of another device or system, such as a server, a cloudenvironment, and/or the like.

As further shown in FIG. 3A, and by reference number 306, controller 118may cause a pump 108 to circulate the semiconductor processing chemicalthrough a filtration loop that includes one or more filters 114.Controller 118 may cause the pump 108 to circulate the semiconductorprocessing chemical through the filtration loop for the configuredquantity of filtration cycles. In some implementations, controller 118may determine that a filtration cycle is complete based on the storagecapacity of the storage drum 102, the volume of semiconductor processingchemical stored in the storage drum 102, the filtration rate of thefiltration loop, and/or the like. For example, controller 118 maydetermine that the storage drum 102 stores 200 liters of semiconductorprocessing chemical and that the filtration loop is capable ofprocessing 20 liters per minute. Accordingly, controller 118 maydetermine that each filtration cycle is 10 minutes.

FIG. 3B illustrates an example implementation of a filtration loop 308for filtering a semiconductor processing chemical directly from astorage drum 102. As shown in FIG. 3B, filtration loop 308 may includeone or more valves 106, pump 108 c, one or more pipes, one or morefittings, and/or one or more other types of plumbing fixtures, and/orthe like that are configured to circulate the semiconductor processingchemical in the storage drum 102 through a filter 114 and back into thestorage drum 102 (e.g., storage drum 102 b).

In some implementations, chemical dispensing system 100 is capable ofindependently supplying semiconductor processing chemical in day tank104 simultaneously with filtering the semiconductor processing chemicalin the storage drum 102 through filtration loop 308. For example,controller 118 may configure independent chemical supply lines inchemical dispensing system 100 such that chemical supply line 202provides the semiconductor processing chemical from day tank 104 to oneor more production POU manifolds 110 for production use or to chemicaltest POU manifold 112 for test in parallel with chemical supply line 208cycling the semiconductor processing chemical in the storage drum 102through filtration loop 308. In these cases, pump 108 a or pump 108 bmay pump the semiconductor processing chemical from day tank 104 througha configured set of one or more pipes, one or more fittings, and/or oneor more other types of plumbing fixtures that is independent from theset of one or more pipes, one or more fittings, and/or one or more othertypes of plumbing fixtures through which pump 108 c pumps thesemiconductor processing chemical in the storage drum 102 throughfiltration loop 308.

As indicated above, FIGS. 3A and 3B are provided as one or moreexamples. Other examples may differ from what is described with regardto FIGS. 3A and 3B.

FIG. 4 is a diagram of example components of a device 400. Device 400may correspond to controller 118. In some implementations, controller118 may include one or more devices 400 and/or one or more components ofdevice 400. As shown in FIG. 4, device 400 may include a bus 410, aprocessor 420, a memory 430, a storage component 440, an input component450, an output component 460, and a communication interface 470.

Bus 410 includes a component that permits communication among multiplecomponents of device 400. Processor 420 is implemented in hardware,firmware, and/or a combination of hardware and software. Processor 420is a central processing unit (CPU), a graphics processing unit (GPU), anaccelerated processing unit (APU), a microprocessor, a microcontroller,a digital signal processor (DSP), a field-programmable gate array(FPGA), an application-specific integrated circuit (ASIC), or anothertype of processing component. In some implementations, processor 420includes one or more processors capable of being programmed to perform afunction. Memory 430 includes a random access memory (RAM), a read onlymemory (ROM), and/or another type of dynamic or static storage device(e.g., a flash memory, a magnetic memory, and/or an optical memory) thatstores information and/or instructions for use by processor 420.

Storage component 440 stores information and/or software related to theoperation and use of device 400. For example, storage component 440 mayinclude a hard disk (e.g., a magnetic disk, an optical disk, and/or amagneto-optic disk), a solid state drive (SSD), a compact disc (CD), adigital versatile disc (DVD), a floppy disk, a cartridge, a magnetictape, and/or another type of non-transitory computer-readable medium,along with a corresponding drive.

Input component 450 includes a component that permits device 400 toreceive information, such as via user input (e.g., a touch screendisplay, a keyboard, a keypad, a mouse, a button, a switch, and/or amicrophone). Additionally, or alternatively, input component 450 mayinclude a component for determining location (e.g., a global positioningsystem (GPS) component) and/or a sensor (e.g., an accelerometer, agyroscope, an actuator, another type of positional or environmentalsensor, and/or the like). Output component 460 includes a component thatprovides output information from device 400 (via, e.g., a display, aspeaker, a haptic feedback component, an audio or visual indicator,and/or the like).

Communication interface 470 includes a transceiver-like component (e.g.,a transceiver, a separate receiver, a separate transmitter, and/or thelike) that enables device 400 to communicate with other devices, such asvia a wired connection, a wireless connection, or a combination of wiredand wireless connections. Communication interface 470 may permit device400 to receive information from another device and/or provideinformation to another device. For example, communication interface 470may include an Ethernet interface, an optical interface, a coaxialinterface, an infrared interface, a radio frequency (RF) interface, auniversal serial bus (USB) interface, a Wi-Fi interface, a cellularnetwork interface, and/or the like.

Device 400 may perform one or more processes described herein. Device400 may perform these processes based on processor 420 executingsoftware instructions stored by a non-transitory computer-readablemedium, such as memory 430 and/or storage component 440. As used herein,the term “computer-readable medium” refers to a non-transitory memorydevice. A memory device includes memory space within a single physicalstorage device or memory space spread across multiple physical storagedevices.

Software instructions may be read into memory 430 and/or storagecomponent 440 from another computer-readable medium or from anotherdevice via communication interface 470. When executed, softwareinstructions stored in memory 430 and/or storage component 440 may causeprocessor 420 to perform one or more processes described herein.Additionally, or alternatively, hardware circuitry may be used in placeof or in combination with software instructions to perform one or moreprocesses described herein. Thus, implementations described herein arenot limited to any specific combination of hardware circuitry andsoftware.

The number and arrangement of components shown in FIG. 4 are provided asan example. In practice, device 400 may include additional components,fewer components, different components, or differently arrangedcomponents than those shown in FIG. 4. Additionally, or alternatively, aset of components (e.g., one or more components) of device 400 mayperform one or more functions described as being performed by anotherset of components of device 400.

FIG. 5 is a flow chart of an example process 500 for dispensing asemiconductor processing chemical. In some implementations, one or moreprocess blocks of FIG. 5 may be performed by a controller (e.g.,controller 180, device 400, and/or the like). In some implementations,one or more process blocks of FIG. 5 may be performed by another deviceor a group of devices separate from or including the controller, such asanother component of a chemical dispensing system (e.g., chemicaldispensing system 100) and/or the like.

As shown in FIG. 5, process 500 may include determining that a test isto be performed for a semiconductor processing chemical in a storagedrum of a chemical dispensing system (block 510). For example, thecontroller (e.g., using processor 420, memory 430, storage component440, input component 450, output component 460, communication interface470, and/or the like) may determine that a test is to be performed for asemiconductor processing chemical in a storage drum (e.g., storage drum102) of a chemical dispensing system (e.g., chemical dispensing system100), as described above.

As further shown in FIG. 5, process 500 may include causing, based ondetermining that the test is to be performed, the chemical dispensingsystem to be transitioned from a production supply configuration to anindependent production and test configuration, in which a first chemicalsupply line of the chemical dispensing system is configured to provide asemiconductor processing chemical in a day tank to a POU or a chemicaltest POU, and a second chemical supply line of the chemical dispensingsystem is configured to provide the semiconductor processing chemical inthe storage drum to the chemical test POU or the production POU based onwhether the first chemical supply line is configured to provide thesemiconductor processing chemical in the day tank to the production POUor the chemical test POU (block 520). For example, the controller (e.g.,using processor 420, memory 430, storage component 440, input component450, output component 460, communication interface 470, and/or the like)may cause, based on determining that the test is to be performed, thechemical dispensing system to be transitioned from a production supplyconfiguration to an independent production and test configuration, asdescribed above. In some implementations, in the independent productionand test configuration, a first chemical supply line (e.g., chemicalsupply line 202) of the chemical dispensing system is configured toprovide a semiconductor processing chemical in a day tank (e.g., daytank 104) to a production POU (e.g., via a production POU manifold 110)or a chemical test POU (e.g., via a chemical test POU manifold 112). Insome implementations, in the independent production and testconfiguration, a second chemical supply line (e.g., chemical supply line208) of the chemical dispensing system is configured to provide thesemiconductor processing chemical in the storage drum to the chemicaltest POU or the production POU based on whether the first chemicalsupply line is configured to provide the semiconductor processingchemical in the day tank to the production POU or the chemical test POU.

Process 500 may include additional implementations, such as any singleimplementation or any combination of implementations described belowand/or in connection with one or more other processes describedelsewhere herein.

In a first implementation, in the independent production and testconfiguration, the first chemical supply line is configured to providethe semiconductor processing chemical in the day tank to the productionPOU, and the second chemical supply line is configured to provide thesemiconductor processing chemical in the storage drum to the chemicaltest POU, and the process 500 includes causing a first pump (e.g., pump108 a, pump 108 b, and/or the like) to provide the semiconductorprocessing chemical in the day tank to the production POU through thefirst chemical supply line, and causing a second pump (e.g., pump 108 c)to provide the semiconductor processing chemical in the storage drum tothe chemical test POU through the second chemical supply line. In asecond implementation, alone or in combination with the firstimplementation, determining that the test is to be performed includesdetermining that the test is to be performed based on determining that anew batch of semiconductor processing chemical was added to the storagedrum.

In a third implementation, alone or in combination with one or more ofthe first and second implementations, determining that the test is to beperformed includes determining that the test is to be performed based onreceiving an instruction to perform the test. In a fourthimplementation, alone or in combination with one or more of the firstthrough third implementations, in the independent production and testconfiguration, the first chemical supply line is configured to providethe semiconductor processing chemical in the day tank to the chemicaltest POU, and the second chemical supply line is configured to providethe semiconductor processing chemical in the storage drum to theproduction POU, and process 500 includes causing a first pump (e.g.,pump 108 a, pump 108 b, and/or the like) to provide the semiconductorprocessing chemical in the day tank to the chemical test POU through thefirst chemical supply line, and causing a second pump (e.g., pump 108 c)to provide the semiconductor processing chemical in the storage drum tothe production POU through the second chemical supply line.

In a fifth implementation, alone or in combination with one or more ofthe first through fourth implementations, process 500 includesdetermining to filter the semiconductor processing chemical in thestorage drum, identifying a configured quantity of filtration cycles forfiltering the semiconductor processing chemical in the storage drum, andcausing a pump to circulate the semiconductor processing chemical in thestorage drum through a filter (e.g., filter 114) included in thechemical dispensing system for a quantity of filtration cycles equal tothe configured quantity of filtration cycles. In a sixth implementation,alone or in combination with one or more of the first through fifthimplementations, process 500 includes determining, based on a test ofthe semiconductor processing chemical in the storage drum, one or moreparameters for the semiconductor processing chemical in the storagedrum, determining that the one or more parameters satisfy one or moretest thresholds, and causing, based on determining that the one or moreparameters for the semiconductor processing chemical in the storage drumsatisfies the one or more test thresholds, the chemical dispensingsystem to be transitioned from the independent production and testconfiguration to the production supply configuration, in which theproduction the first chemical supply line is connected to the day tank,the production POU, and the chemical test POU.

In a seventh implementation, alone or in combination with one or more ofthe first through sixth implementations, process 500 includesdetermining, based a first test of the semiconductor processing chemicalin the storage drum, one or more parameters for the semiconductorprocessing chemical in the storage drum, determining that the one ormore parameters do not satisfy one or more test thresholds, causing thesecond supply line to be flushed based on determining that the one ormore parameters for the semiconductor processing chemical in the storagedrum does not satisfy the one or more test thresholds, and causing asecond test to be performed for the semiconductor processing chemical inthe storage drum after the second chemical supply line is flushed.

Although FIG. 5 shows example blocks of process 500, in someimplementations, process 500 may include additional blocks, fewerblocks, different blocks, or differently arranged blocks than thosedepicted in FIG. 5. Additionally, or alternatively, two or more of theblocks of process 500 may be performed in parallel.

FIG. 6 is a flow chart of an example process 600 for filtering asemiconductor processing chemical. In some implementations, one or moreprocess blocks of FIG. 6 may be performed by a controller (e.g.,controller 180, device 400, and/or the like). In some implementations,one or more process blocks of FIG. 6 may be performed by another deviceor a group of devices separate from or including the controller, such asanother component of a chemical dispensing system (e.g., chemicaldispensing system 100) and/or the like.

As shown in FIG. 6, process 600 may include determining to filter asemiconductor processing chemical in a storage drum included in achemical dispensing system (block 610). For example, the controller(e.g., using processor 420, memory 430, storage component 440, inputcomponent 450, output component 460, communication interface 470, and/orthe like) may determine to filter a semiconductor processing chemical ina storage drum (e.g., storage drum 102) included in a chemicaldispensing system (e.g., chemical dispensing system 100), as describedabove.

As further shown in FIG. 6, process 600 may include identifying aconfigured quantity of filtration cycles for filtering the semiconductorprocessing chemical (block 620). For example, the controller (e.g.,using processor 420, memory 430, storage component 440, input component450, output component 460, communication interface 470, and/or the like)may identify a configured quantity of filtration cycles for filteringthe semiconductor processing chemical, as described above.

As further shown in FIG. 6, process 600 may include causing a pump tocirculate the semiconductor processing chemical through a filterincluded in the chemical dispensing system for a quantity of filtrationcycles equal to the configured quantity of filtration cycles (block630). For example, the controller (e.g., using processor 420, memory430, storage component 440, input component 450, output component 460,communication interface 470, and/or the like) may cause a pump (e.g.,pump 108 c) to circulate the semiconductor processing chemical through afilter (e.g., filter 114) included in the chemical dispensing system fora quantity of filtration cycles equal to the configured quantity offiltration cycles, as described above.

Process 600 may include additional implementations, such as any singleimplementation or any combination of implementations described belowand/or in connection with one or more other processes describedelsewhere herein.

In a first implementation, process 600 includes causing the pump tocirculate the semiconductor processing chemical through a first supplyline (e.g., chemical supply line 208) that is independent from a secondsupply line (e.g., chemical supply line 202) that is used to provide asemiconductor processing chemical in a day tank (e.g., day tank 104) toa production POU (e.g., via a production POU manifold 110). In a secondimplementation, alone or in combination with the first implementation,process 600 includes causing another pump (e.g., pump 108 a, pump 108 b,and/or the like) to provide the semiconductor processing chemical in theday tank to the production POU through the second supply line. In athird implementation, alone or in combination with one or more of thefirst and second implementations, process 600 includes determining thatthe storage drum is in a standby mode; and determining to filter thesemiconductor processing chemical based on determining that the storagedrum is in the standby mode.

Although FIG. 6 shows example blocks of process 600, in someimplementations, process 600 may include additional blocks, fewerblocks, different blocks, or differently arranged blocks than thosedepicted in FIG. 6. Additionally, or alternatively, two or more of theblocks of process 600 may be performed in parallel.

FIG. 7 is a flowchart of an example process 700 for dispensing asemiconductor processing chemical. In some implementations, one or moreprocess blocks of FIG. 7 may be performed by a controller (e.g.,controller 180, device 400, and/or the like). In some implementations,one or more process blocks of FIG. 7 may be performed by another deviceor a group of devices separate from or including the controller, such asanother component in a chemical dispensing system (e.g., chemicaldispensing system 100) and/or the like.

As shown in FIG. 7, process 700 may include causing a chemical supplysystem to operate in a production supply configuration (block 710). Forexample, the controller (e.g., using processor 420, memory 430, storagecomponent 440, input component 450, output component 460, communicationinterface 470, and/or the like) may cause a chemical dispensing system(e.g., chemical dispensing system 100) to operate in a production supplyconfiguration, as described above. In some implementations, in theproduction supply configuration, a first chemical supply line (e.g.,chemical supply line 202) is connected to a day tank (e.g., day tank104) of the chemical dispensing system, one or more production POUmanifolds (e.g., production POU manifold(s) 110), and a chemical testPOU manifold (e.g., chemical test POU manifold 112).

As further shown in FIG. 7, process 700 may include determining toperform a test based on a new semiconductor processing chemical batchbeing added to a storage drum of the chemical dispensing system, basedon a test-run request, based on a maintenance component test for acomponent added to or replaced in the chemical dispensing system, and/orthe like (block 720). For example, the controller (e.g., using processor420, memory 430, storage component 440, input component 450, outputcomponent 460, communication interface 470, and/or the like) maydetermine to perform a test based on a new semiconductor processingchemical batch being added to a storage drum (e.g., storage drum 102) ofthe chemical dispensing system, based on a test-run request, based on amaintenance component test for a component (e.g., a replacement pump108, a replacement valve 106, and/or the like) added to or replaced inthe chemical dispensing system, and/or the like, as described above. Insome implementations, the test may include supplying a semiconductorprocessing chemical to the chemical test POU manifold so that wafer testdata may be generated based on the semiconductor processing chemical.

As further shown in FIG. 7, process 700 may include causing the chemicalsupply system to operate in an independent production and testconfiguration (block 730). For example, the controller (e.g., usingprocessor 420, memory 430, storage component 440, input component 450,output component 460, communication interface 470, and/or the like) maycause the chemical supply system to operate in an independent productionand test configuration, as described above. In some implementations, inthe independent production and test configuration, the first chemicalsupply line (e.g., chemical supply line 202) of the chemical dispensingsystem is configured to provide the semiconductor processing chemical inthe day tank to the production POU manifold or the chemical test POUmanifold, and a second chemical supply line (e.g., chemical supply line208) of the chemical dispensing system is configured to provide asemiconductor processing chemical in a storage drum (e.g., storage drum102) of the chemical dispensing system to the chemical test POU manifoldor the production POU manifold based on whether the first chemicalsupply line is configured to provide the semiconductor processingchemical in the day tank to the production POU manifold or the chemicaltest POU manifold.

As further shown in FIG. 7, process 700 may include generating wafertest data (block 740). For example, the controller (e.g., usingprocessor 420, memory 430, storage component 440, input component 450,output component 460, communication interface 470, and/or the like) maygenerate wafer test data, as described above. In some implementations,the wafer test data may be generated based on performing the test whilethe chemical dispensing system is operating in the independentproduction and test configuration. In some implementations, thecontroller may determine whether the test passed or failed based on thewafer test data.

As further shown in FIG. 7, process 700 may include automaticallyperforming a flush of the chemical supply line that was used to supplythe semiconductor processing chemical to the chemical test POU manifold(block 750). For example, the controller (e.g., using processor 420,memory 430, storage component 440, input component 450, output component460, communication interface 470, and/or the like) may automaticallyperform a flush of the chemical supply line that was used to supply thesemiconductor processing chemical to the chemical test POU manifold, asdescribed above. In some implementations, the flush of the chemicalsupply line that was used to supply the semiconductor processingchemical to the chemical test POU manifold may be performed based on adetermination that the test failed (block 740—Fail).

As further shown in FIG. 7, process 700 may include automaticallyrestarting the test (block 760). For example, the controller (e.g.,using processor 420, memory 430, storage component 440, input component450, output component 460, communication interface 470, and/or the like)may automatically restart the test, as described above. In someimplementations, the actions associated with blocks 740-760 may beperformed until the controller determines that the test passes. In someimplementations, the controller may cause the semiconductor processingchemical to be filtered for one or more filtration cycles based ondetermining that the test failed.

As further shown in FIG. 7, process 700 may include automaticallycausing the chemical supply system to transition to the productionsupply configuration (block 770). For example, the controller (e.g.,using processor 420, memory 430, storage component 440, input component450, output component 460, communication interface 470, and/or the like)may automatically cause the chemical supply system to transition to theproduction supply configuration, as described above. In someimplementations, the controller may automatically cause the chemicalsupply system to transition to the production supply configuration basedon determining that the test passed (block 740—Pass).

Process 700 may include additional implementations, such as any singleimplementation or any combination of implementations described inconnection with one or more other processes described elsewhere herein.Although FIG. 7 shows example blocks of process 700, in someimplementations, process 700 may include additional blocks, fewerblocks, different blocks, or differently arranged blocks than thosedepicted in FIG. 7. Additionally, or alternatively, two or more of theblocks of process 700 may be performed in parallel.

In this way, chemical dispensing system 100 is capable of simultaneouslysupplying a semiconductor processing chemical for production and testingthrough the use of independent chemical supply lines 202 and 208, whichreduces production downtime of an associated semiconductor process,increases throughput and capability of the semiconductor process, and/orthe like. Moreover, the capability to simultaneously supply thesemiconductor processing chemical for production and testing allows foran increased quantity of semiconductor processing chemical batches to betested with minimal impact to production, which increases qualitycontrol over the semiconductor processing chemical. In addition, theindependent chemical supply lines 202 and 208 may be used to supply thesemiconductor processing chemical to production while independentlyfiltering semiconductor processing chemical directly from a storage drum102 through a filtration loop 308.

As described in greater detail above, some implementations describedherein provide a chemical dispensing system. The chemical dispensingsystem includes a first chemical supply line configured to provide asemiconductor processing chemical from a day tank to one or moreproduction POU manifolds or a chemical test POU manifold. The chemicaldispensing system includes a second chemical supply line configured toprovide a semiconductor processing chemical from a storage drum to thechemical test POU manifold or the one or more production POU manifoldsbased on whether the first chemical supply line is configured to providethe semiconductor processing chemical from the day tank to the one ormore POU manifolds or the chemical test POU manifold. A pump used forthe first chemical supply line is different from a pump used for thesecond chemical supply line.

As described in greater detail above, some implementations describedherein provide a method. The method includes determining, by one or moreprocessors, that a test is to be performed for a semiconductorprocessing chemical in a storage drum of a chemical dispensing system.The method includes causing, by the one or more processors and based ondetermining that the test is to be performed, the chemical dispensingsystem to be transitioned from a production supply configuration to anindependent production and test configuration. In the independentproduction and test configuration, a first chemical supply line of thechemical dispensing system is configured to provide a semiconductorprocessing chemical in a day tank to a production POU or a chemical testPOU. In the independent production and test configuration, a secondchemical supply line of the chemical dispensing system is configured toprovide the semiconductor processing chemical in the storage drum to thechemical test POU the production POU based on whether the first chemicalsupply line is configured to provide the semiconductor processingchemical in the day tank to the production POU or the chemical test POU.

As described in greater detail above, some implementations describedherein provide a device. The device includes one or more memories andone or more processors, communicatively coupled to the one or morememories. The one or more processors are to determine to filter asemiconductor processing chemical in a storage drum included in achemical dispensing system. The one or more processors are to identify aconfigured quantity of filtration cycles for filtering the semiconductorprocessing chemical. The one or more processors are to cause a pump tocirculate the semiconductor processing chemical through a filterincluded in the chemical dispensing system for a quantity of filtrationcycles equal to the configured quantity of filtration cycles.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A chemical dispensing system, comprising: a firstchemical supply line configured to provide a semiconductor processingchemical from a day tank to one or more production point of use (POU)manifolds or a chemical test POU manifold; and a second chemical supplyline configured to provide a semiconductor processing chemical from astorage drum to the chemical test POU manifold or the one or moreproduction POU manifolds based on whether the first chemical supply lineis configured to provide the semiconductor processing chemical from theday tank to the one or more production POU manifolds or the chemicaltest POU manifold, wherein a pump that is used for the first chemicalsupply line is different from a pump that is used for the secondchemical supply line.
 2. The chemical dispensing system of claim 1,wherein the first chemical supply line is configured to provide thesemiconductor processing chemical from the day tank to the one or moreproduction POU manifolds; and wherein the second chemical supply line isconfigured to provide the semiconductor processing chemical from thestorage drum to the chemical test POU manifold.
 3. The chemicaldispensing system of claim 2, further comprising: one or more firstpumps to pump the semiconductor processing chemical from the day tank tothe one or more production POU manifolds through the first chemicalsupply line; and a second pump to pump the semiconductor processingchemical from the storage drum to the chemical test POU manifold throughthe second chemical supply line.
 4. The chemical dispensing system ofclaim 1, wherein the first chemical supply line is configured to providethe semiconductor processing chemical from the day tank to the chemicaltest POU manifold; wherein the second chemical supply line is configuredto provide the semiconductor processing chemical from the storage drumto the one or more production POU manifolds; and wherein the chemicaldispensing system further comprises: one or more first pumps to pump thesemiconductor processing chemical from the day tank to the chemical testPOU manifold through the first chemical supply line; and a second pumpto pump the semiconductor processing chemical from the storage drum tothe one or more production POU manifolds through the second chemicalsupply line.
 5. The chemical dispensing system of claim 1, furthercomprising: a controller, to: determine to filter the semiconductorprocessing chemical in the storage drum; identify a configured quantityof filtration cycles for filtering the semiconductor processing chemicalin the storage drum; and cause a pump to circulate the semiconductorprocessing chemical in the storage drum through a filter included in thechemical dispensing system for a quantity of filtration cycles equal tothe configured quantity of filtration cycles.
 6. The chemical dispensingsystem of claim 1, further comprising: a test POU manifold, wherein thetest POU manifold comprises: a plurality of POU valves configured toprovide at least one of the semiconductor processing chemical from theday tank or the semiconductor processing chemical from the storage drumto a plurality of testing POUs.
 7. The chemical dispensing system ofclaim 6, wherein the test POU manifold further comprises: a flush drainline configured to drain semiconductor processing chemical from the testPOU manifold; and a sampling line configured to provide a portion of thesemiconductor processing chemical, drained from the test POU manifold,for quality assurance sampling.
 8. The chemical dispensing system ofclaim 1, further comprising: one or more first valves to switch thefirst chemical supply line between the one or more production POUmanifolds and chemical test POU manifold; and one or more second valvesto switch the second chemical supply line between the one or moreproduction POU manifolds and chemical test POU manifold.
 9. A method,comprising: determining, by one or more processors, that a test is to beperformed for a semiconductor processing chemical in a storage drum of achemical dispensing system; and causing, by the one or more processorsand based on determining that the test is to be performed, the chemicaldispensing system to be transitioned from a production supplyconfiguration to an independent production and test configuration,wherein, in the independent production and test configuration, a firstchemical supply line of the chemical dispensing system is configured toprovide a semiconductor processing chemical in a day tank to aproduction point of use (POU) or a chemical test POU, and wherein, inthe independent production and test configuration, a second chemicalsupply line of the chemical dispensing system is configured to providethe semiconductor processing chemical in the storage drum to thechemical test POU or the production POU based on whether the firstchemical supply line is configured to provide the semiconductorprocessing chemical in the day tank to the production POU or thechemical test POU.
 10. The method of claim 9, wherein, in theindependent production and test configuration: the first chemical supplyline is configured to provide the semiconductor processing chemical inthe day tank to the production POU, and the second chemical supply lineis configured to provide the semiconductor processing chemical in thestorage drum to the chemical test POU; and wherein the method furthercomprises: causing a first pump to provide the semiconductor processingchemical in the day tank to the production POU through the firstchemical supply line; and causing a second pump to provide thesemiconductor processing chemical in the storage drum to the chemicaltest POU through the second chemical supply line.
 11. The method ofclaim 9, wherein determining that the test is to be performed comprises:determining that the test is to be performed based on determining that anew batch of semiconductor processing chemical was added to the storagedrum.
 12. The method of claim 9, wherein determining that the test is tobe performed comprises: determining that the test is to be performedbased on receiving an instruction to perform the test.
 13. The method ofclaim 9, wherein, in the independent production and test configuration:the first chemical supply line is configured to provide thesemiconductor processing chemical in the day tank to the chemical testPOU, and the second chemical supply line is configured to provide thesemiconductor processing chemical in the storage drum to the productionPOU; and wherein the method further comprises: causing a first pump toprovide the semiconductor processing chemical in the day tank to thechemical test POU through the first chemical supply line; and causing asecond pump to provide the semiconductor processing chemical in thestorage drum to the production POU through the second chemical supplyline.
 14. The method of claim 9, further comprising: determining tofilter the semiconductor processing chemical in the storage drum;identifying a configured quantity of filtration cycles for filtering thesemiconductor processing chemical in the storage drum; and causing apump to circulate the semiconductor processing chemical in the storagedrum through a filter included in the chemical dispensing system for aquantity of filtration cycles equal to the configured quantity offiltration cycles.
 15. The method of claim 9, further comprising:determining, based on a test of the semiconductor processing chemical inthe storage drum, one or more parameters for the semiconductorprocessing chemical in the storage drum; determining that the one ormore parameters satisfy one or more test thresholds; and causing, basedon determining that the one or more parameters for the semiconductorprocessing chemical in the storage drum satisfies the one or more testthresholds, the chemical dispensing system to be transitioned from theindependent production and test configuration to the production supplyconfiguration, wherein, in the production supply configuration, thefirst chemical supply line is connected to the day tank, the productionPOU, and the chemical test POU.
 16. The method of claim 9, furthercomprising: determining, based a first test of the semiconductorprocessing chemical in the storage drum, one or more parameters for thesemiconductor processing chemical in the storage drum; determining thatthe one or more parameters do not satisfy one or more test thresholds;causing the second supply line to be flushed based on determining thatthe one or more parameters for the semiconductor processing chemical inthe storage drum does not satisfy the one or more test thresholds; andcausing a second test to be performed for the semiconductor processingchemical in the storage drum after the second chemical supply line isflushed.
 17. A device, comprising: one or more memories; and one or moreprocessors, communicatively coupled to the one or more memories, to:determine to filter a semiconductor processing chemical in a storagedrum included in a chemical dispensing system; identify a configuredquantity of filtration cycles for filtering the semiconductor processingchemical; and cause a pump to circulate the semiconductor processingchemical through a filter included in the chemical dispensing system fora quantity of filtration cycles equal to the configured quantity offiltration cycles.
 18. The device of claim 17, wherein the one or moreprocessors, when causing the pump to circulate the semiconductorprocessing chemical through the filter for the quantity of filtrationcycles, are configured to: cause the pump to circulate the semiconductorprocessing chemical through a first supply line that is independent froma second supply line that is used to provide a semiconductor processingchemical in a day tank to a production point of use (POU).
 19. Thedevice of claim 18, wherein the one or more processors are furtherconfigured to: cause another pump to provide the semiconductorprocessing chemical in the day tank to the production POU through thesecond supply line.
 20. The device of claim 17, wherein the one or moreprocessors, when determining to filter the semiconductor processingchemical in the storage drum, are configured to: determine that thestorage drum is in a standby mode; and determine to filter thesemiconductor processing chemical based on determining that the storagedrum is in the standby mode.